On the morning of 9 November 2026 in Tokyo, FPT Corporation and SBI Holdings, one of Japan's major financial groups, signed a memorandum of understanding on semiconductor cooperation. Under the MoU, SBI will consider taking part as an investor in a project for a memory chip packaging and testing (OSAT) plant in Hanoi. The signing was witnessed by General Secretary and State President To Lam during his official visit to Japan, on the sidelines of a meeting with leaders of the Japan Business Federation (Keidanren).

Project structure

According to the reports, FPT will work through its subsidiary FPT IS Co., Ltd to form a joint venture with two South Korean semiconductor companies to build and operate the plant in Hanoi. Specific terms will be discussed further. The reports did not disclose capacity, total investment or a construction timeline; the stated aim is to bring the plant into operation soon.

SBI Group was founded in 1999 and operates in securities, banking, insurance, asset management and private equity.

Why packaging and testing matter

Packaging and testing are the final stages of chip production, where chips are protected, connected and quality-checked before reaching device makers. For FPT, the project fits its plan to build packaging and testing capability and train semiconductor engineers; the company already runs a chip testing and packaging plant in Bac Ninh.

According to Tin nhanh Chung khoan, semiconductors are identified as one of the strategic technology fields Vietnam is promoting in pursuit of technological self-reliance.

Key takeaways